近15年来，负责完成和正在主持国家自然科学基金共5项、国家863计划1项和部级等纵向研究项目6项，以第一发明人获国家发明专利授权50多项；以通讯作者，指导研究生在ieee ted\edl\jmems\sensors和jmm\sensors and actuators a-physical等国际权威专业期刊发表了被sci收录学术论文80多篇，在本专业的重要国际学术会议上发表了被istp收录学术论文20多篇，出版专著1部（廖小平、张志强、易真翔、闫浩《微电子机械微波通讯信号检测集成系统》科学出版社 2016）。
发表在ieee的代表性论文：
[1] sen zhang, xiaoping liao*，a c-band mems frequency discriminator with high sensitivity and linearity，ieee electron device letters, 42(3): 410-413, 2021.
[2] jian-hua li, xiaoping liao*, chenlei chu，electromagnetic-thermal-electric analysis of indirectly-heated rf mems power sensors with different terminal resistor dimensions，ieee sensors journal, 21(4): 4342-4349, 2021.
[3] jian-hua li, xiaoping liao*, chenlei chu，a novel thermistor-based rf power sensor with wheatstone bridge fabricating on mems membrane，ieee journal of microelectromechanical systems, 29(5): 1314-1321, 2020.
[4] sen zhang, xiaoping liao*，investigations of the thermoelectric-photoelectric integrated power generator with i-shaped thermocouple structure and its test structures，ieee sensors journal, 19(23): 11113-11119, 2019.
[5] jiabin yan, xiaoping liao*, sichao ji，sen zhang，a novel multi-source micro power generator for harvesting thermal and optical energy，ieee electron device letters, 40(2):349-352, 2019.
[6] jiabin yan, xiaoping liao*, sichao ji，sen zhang，mems-based thermoelectric–photoelectric integrated power generator，ieee journal of microelectromechanical systems, 28(1):1-3, 2019.
[7] chenlei chu, xiaoping liao*, chenglin li，chen chen, a micro-machined phase discriminator with improved power capacity on c-band and x-band, ieee sensors journal, 19(6):2133-2139, 2019.
[8] hao yan, xiaoping liao*, chen chen, chenglin li, high-power handling analysis of a capacitive mems power sensor at x-band, ieee sensors journal, 18(13): 5272-5277, 2018.
[9] jiabin yan, xiaoping liao*, deyang yan, and youguo chen. review of micro thermoelectric generator，ieee journal of microelectromechanical systems, 27(1):1-18, 2018.
[10]hao yan, xiaoping liao*, chenglin li, a dual-channel mems amplitude demodulator for on-line detection in radio relay station, ieee electron device letters，38(8)：1121-1124，2017.
[11] chenlei chu, xiaoping liao*, improved dynamic range of microwave power sensor by mems cantilever beam, ieee journal of microelectromechanical systems, 6(6):1183-1185, 2017.
[12] hao yan, xiaoping liao*, an x-band dual channel microwave phase detector based on gaas mmic technology, ieee sensors journal, 16(17): 6515-6516, 2016.
[13] juzheng han, xiaoping liao*, a compact broadband microwave phase detector based on mems technology, ieee sensors journal, 16(10): 3480-3481, 2016.
[14] yan, jiabin, xiaoping liao*, research on the response time of indirect-heating microwave power sensor, ieee sensors journal, 16(13): 5270-5276, 2016.
[15] hao yan, xiaoping liao*, the high power up to 1 w characteristics of the capacitive microwave power sensor with grounded mems beam, ieee sensors journal, 15(12): 6765-6766, 2015.
[16] juzheng han, xiaoping liao*, third-order intermodulation of an mems clamped–clamped beam capacitive power sensor based on gaas technology, ieee sensors journal, 15(7): 3645-3646, 2015.
[17]zhenxiang yi， xiaoping liao*, measurements on intermodulation distortion of capacitive power sensor based on mems cantilever beam, ieee sensors journal, 14(3): 621-622, 2014.
[18] zhenxiang yi, xiaoping liao*, hao yan, a frequency-compensation-type microwave power sensor fabricated by gaas mmic process, ieee sensors journal, 14(9):2936-2937, 2014.
[19]zhiqiang zhang，xiaoping liao*,micromachined passive bandpass filters based on gaas monolithic-microwave-integrated-circuit technology, ieee transactions on electron devices, 60(1), 221–228, 2013.
[20] debo wang, xiaoping liao*, and tong liu, optimization of indirectly-heated type microwave power sensors based on gaas micromachining, ieee sensors journal, 12(5):1349-1355, 2012.
[21] debo wang, xiaoping liao*, and tong liu, a novel thermoelectric and capacitive power sensor with improved dynamic range based on gaas mmic technology, ieee electron device letters, 33(2): 269-271, 2012.
[22] zhiqiang zhang and xiaoping liao*, a thermocouple-based self-heating rf power sensor with gaas mmic-compatible micromachining technology, ieee electron device letters, 33(4): 606-608, 2012.
[23] debo wang, xiaoping liao*, and tong liu, a thermoelectric power sensor and its package based on mems technology，ieee journal of microelectromechanical systems, 21(1): 121-131, 2012.
[24] zhiqiang zhang, xiaoping liao*, packaging-test-fixture for in-line coupling rf mems power sensors, ieee journal of microelectromechanical systems, 20(6): 1231-1233, 2011.
