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尚金堂职务:
单位: 电话:025-83792632-8802 出生年月:1977-07-01 邮箱:jshang@seu.edu.cn 学历:博士 地址: 职称:教授
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个人简介
是博士生导师、首届卓越青年科学基金获得者,还曾获教育部新世纪优秀人才、江苏特聘教授等人才项目的支持。本、硕、博毕业于东南大学,2008.8-2009.8在美国佐治亚理工学院做访问学者,是国际电子器件与技术会议(ieee ectc)新技术分会委员(2013-今)、ieee高级会员(2012-今)、国际电子封装与技术会议(icept)技术委员会委员(2009-今)/分会主席(2014-2017)和中国半导体封装协会理事(2014-今)。主持/完成包括国家自然科学基金、国家863、国家重点研发计划课题、预研重点基金、国家重大科技专项课题等多个国家/省部级项目和行业龙头企业研究项目。
教育经历
工作经历
讲授课程
教学研究
出版物
研究领域或方向

1.芯片级原子器件设计、制造与集成。例如,芯片级原子磁力仪,可应用于脑磁、心磁等微弱磁场测量,以及地磁测量。

2.微壳体谐振子设计、制造与集成。可应用于高性能微型导航系统。

3、微纳系统(mems/ic)设计、制造、材料与封装技术

研究项目
研究成果

研究成果被成功应用于航天和民用领域。获国家技术发明二等奖、多项国际会议论文奖(通讯作者)和江苏省科技进步奖。获60余项发明专利授权(包括3项美国专利授权),在ieee tcpmtieee ectc等国际主流期刊和会议上发表论文100余篇。与江阴长电、华进半导体联合培养工程博士和硕士生。在02专项以及企业项目资助下,与江阴长电、中科院微电子所、航天13所等多个单位合作,开展了铜柱凸点、led封装、基于垂直生长碳纳米管阵列热界面材料、硅/玻璃复合基板技术和先进传感器封装技术等研究。部分论著和专利如下:


  

1.yu ji, jintang shang, guoliang li, jin zhang, jianfeng zhang. microfabricated shaped rubidium vapor cell for miniaturized atomic magnetometers. ieee sensors letters,4(2),1-4:2020

2.ji, yu, shang jintang, zhang jin, micro-printing of patterned diamond-like carbon coatings on glass by anodic bonding, electronics letters,55(8),483-484:2019

3.luo bin, shang jintang, su, zhaoxi, zhang jianfeng, wong ching-ping, , ieee transactions on components, packaging and manufacturing technology,9(3),567-574:2019

4.yu ji, jintang shang, jin zhang, guoliang li. magnetic gradient measurement using micro-fabricated shaped rubidium vapor cell. ieee transactions on magnetics, 55(9):2019

5.luo b, shang j, su z, et al. height adjustment of 3-d axisymmetric microumbrella shells for tailoring wineglass frequency [j]. ieee transactions on components, packaging and manufacturing technology, 2019, 9(3): 567-574

6.luo b, ma m, zhang m, et al. composite glass-silicon substrates embedded with microcomponents for mems system integration [j]. ieee transactions on components, packaging and manufacturing technology, 2019, 9(2): 201-208

7.ji, yu, shang jintan, zhang jin, micro-printing of patterned diamond-like carbon coatings on glass by anodic bonding, electronics letters,55(8),483-484:2019

8.yu ji, jintang shang, qi gan, lei wu, c.p. wong, improvement of sensitivity by using micro-fabricated spherical alkali vapor cells for chip-scale atomic magnetometers, ieee transactions on components, packaging and manufacturing technology, 2018, 8(10):1715-1722

9.lei wu, jintang shang, yu ji , qi gan, and ching-ping wong, influence of buffer-gas pressure inside micro alkali vapor cells on the performance of chip-scale serf magnetometers, ieee transactions on components, packaging and manufacturing technology, 2018, 8(4):621-625

10.qi gan, jintang shang, yu ji, and lei wu, simultaneous excitation of 85rb and 87rb isotopes inside a microfabricated vapor cell with double-rf fields for a chip-scale mz magnetometer, review of scientific instruments, 2017, 88(11): 115009

11.kangni liu, jintang shang, jin zhang, xiang yue, chen ye, jianfeng zhang, ching-ping wong, microfabricated serf atomic magnetometers for measurement of weak magnetic field, 2020 ieee 70th electronic components and technology conference(ectc),2020,pp.991-996

12.ji y, gan q, wu l, shang j, geometry influence of the micro alkali vapor cell on the sensitivity of the chip-scale atomic magnetometers, micro electro mechanical systems (mems), 2017 ieee 30th international conference on. ieee, 2017: 342-345

13.bin luo, jintang shang, yuzhen zhang, hemispherical glass shell resonators fabricated using chemical foaming process, 2015 ieee 65th electronic components and technology conference (ectc), 2015, pp. 2217-2221

14.mengying ma, jintang shang, bin luo, preparation of wafer level glass-embedded high-aspect-ratio passives using a glass reflow process. 28th ieee international conference on micro electro mechanical systems (ieee mems 2015), 2015, pp. 427-430

15.jintang shang, boyin chen, wei lin, ching-ping wong, di zhang, chao xu, junwen liu and qin-an huang. preparation of wafer-level glass cavities by a low-cost chemical foaming process(cfp). lab on a chip, 2011, 11 (8):1532 – 1540.

16.shang j, ma m. wafer-level manufacturing method for embedding passive element in glass substrate: u.s. patent 10,321,577 [p]. 2019-1-11

17.shang j. foaming process for preparing wafer-level glass micro-cavities: u.s. patent 8,887,527 [p]. 2014-11-18

18.shang j, luo b. micro three-dimensional shell resonator gyroscope: u.s. patent 10,527,422 [p]. 2020-1-7



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